RFI and EMI - Shielding and Absorbing Materials

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling. For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com. 3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

- KEMET Corporation is a leading global supplier of electronic components. We offer our customers the broadest selection of capacitor technologies in the industry across all dielectrics, along with an expanding range of electro-mechanical devices, electromagnetic compatibility solutions and supercapacitors. Our vision is to be the preferred supplier of electronic component solutions for customers demanding the highest standards of quality, delivery and service.

- t-Global Technology is a leading manufacturer and supplier of thermal management solutions. t-Global manufactures materials in their state of art facilities in Taiwan and the UK. Their broad product portfolio covers silicone and non-silicone gap fillers, silicone and non-silicone putties, ceramic heat spreaders, combined thermal and EMI absorbers and a wide selection of die-cut insulators. Taiwan is the central location for new product development and research and the UK takes responsibility for complex engineering projects, rapid prototyping and dispensing technology. t-Global’s philosophy is based around a very short lead-time and low MOQ’s, which translates into rapid prototyping and a short time to market.

TDK Corporation (Tokyo Denkikagaku Kogyo) was established in December 1935 with the aim of becoming the world's first commercial manufacturer of the magnetic material ferrite. TDK, since then, has continued ceaselessly to turn out a variety of products and services making use of its materials technology, centering on ferrite and ceramics, and processing technology, which draws out the properties of materials to the maximum degree. The founding spirit of TDK, "contribute to culture and industry through creativity," continues to this day to pulsate throughout the company.