LAPIS Semiconductor LAPIS Semiconductor
BSM180D12P3C007
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BSM180D12P3C007

Part Number: BSM180D12P3C007
Manufacturer/Brand: LAPIS Semiconductor
Product description SIC POWER MODULE
Datasheets: 1.BSM180D12P3C007.pdf 2.BSM180D12P3C007.pdf
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Lead Free Status / ROHS Status Lead free / ROHS Compliant
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Specifications of BSM180D12P3C007

Part Number BSM180D12P3C007 Manufacturer LAPIS Semiconductor
Series -FET Type 2 N-Channel (Dual)
Packaging BulkDescription SIC POWER MODULE
FET Feature Silicon Carbide (SiC)Other Names Q9597863
Power - Max 880WMounting Type Surface Mount
Package / Case ModuleQuantity Available 179 pcs
Vgs(th) (Max) @ Id 5.6V @ 50mADetailed Description Mosfet Array 2 N-Channel (Dual) 1200V (1.2kV) 180A (Tc) 880W Surface Mount Module
Operating Temperature 175°C (TJ)Rds On (Max) @ Id, Vgs -
Supplier Device Package ModuleGate Charge (Qg) (Max) @ Vgs -
Drain to Source Voltage (Vdss) 1200V (1.2kV)Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)Input Capacitance (Ciss) (Max) @ Vds 900pF @ 10V
Current - Continuous Drain (Id) @ 25°C 180A (Tc)
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